Method for forming a light conversion material
AssigneeMicron Technology, Inc.
InventorsCharles M. Watkins, Kevin Tetz, Thomas Gehrke
Life of this patent
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Abstract
A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.
Claims38
A method for forming a light conversion assembly, comprising:
- forming a cover over a light emitting diode (LED) chip;
- dispensing a conversion material onto the cover to form a conversion coating on and/or in the cover;
- and
- encapsulating the LED, the cover, and the conversion coating within an encapsulant.
A method for constructing a conversion lens over a semiconductor light emitting diode (LED), comprising
- constructing a semiconductor LED;
- placing the LED in a package comprising a reflective cup;
- forming a first silicone cover over the LED;
- forming a first conversion coating on at least a portion of the first silicone cover;
- forming a second silicone cover over at least a portion of the first conversion coating;
- forming a second conversion coating over at least a portion of the second silicone cover;
- and
- cover the second conversion coating with an encapsulant layer positioned in the reflective cup.
A system for manufacturing a semiconductor light emitting diode (LED), comprising:
- means for encasing an exposed surface of an LED within a cover, the cover being at least partially uncured;
- means for dispensing a conversion material onto the at least partially uncured cover;
- and
- means for encapsulating the LED, the cover, and the conversion material in an encapsulant.
A system for manufacturing a light emitting diode (LED) assembly, comprising:
- an LED;
- a cover over the LED, wherein the cover comprises a material having a desired transparency to light;
- a conversion coating on the cover;
- and
- an encapsulant encasing the conversion coating, the cover and the LED.
Dependencies are inferred from the claim text.