Semiconductor manufacturing apparatus and semiconductor manufacturing method
AssigneeKabushiki Kaisha Toshiba
InventorsKazumasa TANIDA, Naoko Yamaguchi, Satoshi Hongo, Chiaki Takubo, Hideo Numata
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Abstract
According to one embodiment, a first substrate and a second substrate are pressed from an opposite surface of a joint surface of the second substrate such that a joint surface of the first substrate and the joint surface of the second substrate are in contact with each other. The second substrate is restrained by a member to provide a gap between the joint surfaces. It is determined, based on a temporal change of a joint interface calculated based on an image imaged from the opposite surface side of the joint surface, whether joining is normally performed.
Claims20
A semiconductor manufacturing apparatus that joins a joint surface of a first substrate and a joint surface of a second substrate, the semiconductor manufacturing apparatus comprising:
- a pressing unit that presses the first substrate and the second substrate, which are arranged to oppose the joint surfaces thereof each other, in a predetermined position on an opposite surface of the joint surface of the second substrate such that the joint surface of the first substrate and the joint surface of the second substrate are in contact with each other;
- a member that restrains the second substrate to provide a gap between the joint surface of the first substrate and the joint surface of the second substrate;
- a sensor unit that images an image including a plane area of the first substrate from the opposite surface side of the joint surface of the second substrate or from an opposite surface side of the joint surface of the first substrate;
- and
- a processing unit that calculates, based on the image, a joint interface and determines, based on a rate of change of the joint interface, whether joining is normally performed.
A semiconductor manufacturing method for joining a joint surface of a first substrate and a joint surface of a second substrate, the semiconductor manufacturing method comprising:
- pressing the first substrate and the second substrate, which are arranged to oppose the joint surfaces thereof each other, in a predetermined position on an opposite surface of the joint surface of the second substrate such that the joint surface of the first substrate and the joint surface of the second substrate are in contact with each other;
- restraining the second substrate with a member to provide a gap between the joint surface of the first substrate and the joint surface of the second substrate;
- imaging an image including a plane area of the first substrate from the opposite surface side of the joint surface of the second substrate or from an opposite surface side of the joint surface of the first substrate;
- and
- calculating, based on the image, a joint interface and determining, based on a rate of change of the joint interface, whether joining is normally performed.
Dependencies are inferred from the claim text.