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US 2011/0217793 A1Published application
Methods of Processing a Substrate and Forming a Micromagnetic Device
AssigneeEnpirion, Inc.
InventorsKen Takahashi, Trifon M. Liakopoulos
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Abstract
A method of processing a substrate with a conductive film formed thereover and method of forming a micromagnetic device. In one embodiment, the method of processing the substrate includes reducing a temperature of the substrate to a stress-compensating temperature, and maintaining the temperature of the substrate at the stress-compensating temperature for a period of time. The method also includes increasing the temperature of the substrate above the stress-compensating temperature.
Claims20
A method of forming a device, comprising:
- providing a substrate;
- forming a magnetic core layer over said substrate;
- increasing a temperature of said device to a curing temperature;
- reducing said temperature of said device to a stress-compensating temperature below room temperature;
- maintaining said temperature of said device at said stress-compensating temperature for a period of time;
- and
- increasing said temperature of said device above said stress-compensating temperature.
4 more elements
A method of forming a device, comprising:
- providing a substrate;
- forming a conductive winding layer over said substrate;
- increasing a temperature of said device to a curing temperature;
- reducing said temperature of said device to a stress-compensating temperature below room temperature;
- maintaining said temperature of said device at said stress-compensating temperature for a period of time;
- and
- increasing said temperature of said device above said stress-compensating temperature.
4 more elements
Dependencies are inferred from the claim text.