Joining of mouldings of different polyamide compounds
AssigneeEvonik Degussa GmbH
InventorsSonja Bollmann, Rainer Goering, Franz-Erich Baumann, Andreas Dowe, Vera Schiemann
Life of this patent
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Abstract
A moulding compound for joining two mouldings each made of a PA11 and/or PA12 moulding compound contains at least 50% by weight of a polyamide component so chosen that it is preparable from linear aliphatic diamines and dicarboxylic acids and/or lactams or ω-aminocarboxylic acids, there being 11 to 12 carbon atoms present per carboxamide group in the repeating units, and, furthermore, this polyamide component containing not more than 80% by weight of either one of the polyamides PA11 and PA12. With this compound a firm weld is obtained both to a PA11 moulding and to a PA12 moulding.
Claims12
A method of bonding at least a first moulding, and a second moulding, comprising:
- joining at least a first moulding and a second moulding, wherein each of said mouldings comprise a PA11, a PA12 moulding compound, or both, wherein each of said moulding compounds comprise at least 50% by weight of a polyamide component and the polyamide component being so chosen that it is preparable from linear aliphatic diamines and dicarboxylic acids or lactams or ω-amino-carboxylic acids, or mixtures thereof, there being 11 to 12 carbon atoms present per carboxamide group in the repeating units, and, furthermore, said polyamide component comprising not more than 80% by weight of either one of the polyamides PA11 and PA12.
Dependencies are inferred from the claim text.