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US 2011/0217519 A1Published application
Layered structure and piezoelectric device using the same
AssigneeFUJIFILM Corporation
InventorYukio SAKASHITA
Life of this patent
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Abstract
A layered structure, including a flexible resin substrate and a composite piezoelectric film formed on the resin substrate and constituted by an organic polymer resin matrix and a plurality of inorganic piezoelectric bodies dispersed in the matrix.
Claims14
A layered structure, comprising:
- a resin substrate;
- and
- a composite piezoelectric film formed on the substrate and constituted by an organic polymer resin matrix and a plurality of inorganic piezoelectric bodies dispersed in the matrix.
A method of manufacturing a layered structure, comprising the steps of:
- providing a resin substrate;
- applying an application liquid which includes an organic polymer resin and a plurality of inorganic piezoelectric bodies dispersed in the resin and forming a composite piezoelectric film on the substrate;
- and
- patterning at least the composite piezoelectric film into a predetermined pattern.
1 more element
Dependencies are inferred from the claim text.