Method for processing a chemical vapor deposition (cvd) and a cvd device using the same
AssigneeTeoss Co., Ltd.
InventorsTsuyoshi Murai, Toshinori Konaka, Masayuki Suzuki
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AssigneeTeoss Co., Ltd.
InventorsTsuyoshi Murai, Toshinori Konaka, Masayuki Suzuki
Estimating the term…
A method for CVD processing, comprises the steps of: fixing both ends of a silicon substrate to a pair of electrode mounts; lowering a resistance value of the silicon substrate by raising temperature of the silicon substrate with heat from an outer heater provided outside the case; heating the silicon substrate to a temperature at which the CVD process can be started by applying electrical current, and lowering an atmosphere temperature in the CVD space by stopping the outer heater; and forming a thin film on a surface of the silicon substrate by injecting source gas into the CVD space, when the silicon substrate is heated to the temperature at which the CVD process can be started and the atmosphere temperature in the CVD space is lowered to a predetermined temperature.
A method for CVD processing, comprising the steps of:
A CVD device comprising:
Dependencies are inferred from the claim text.