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US 2011/0216922 A1Published application
Silicon condenser microphone
AssigneesAac Acoustic Technologies (Shenzhen) Co., Ltd., American Audio Components Inc.
InventorsHai-Feng Li, Rui Zhang
Life of this patent
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Abstract
Disclosed is a silicon condenser microphone including a backplate having a plurality of perforations therethrough, a diaphragm opposed from the backplate for forming a capacitor. The diaphragm includes a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate. The first part is connected to the ground and the second part is connected to a bias voltage.
Claims9
A silicon condenser microphone, comprising:
- a silicon base;
- a backplate located above the base and defines a plurality of perforations;
- a diaphragm opposed from the backplate, the diaphragm comprising an inner vibrating part and an outer part surrounding the inner part;
- a capacitor formed by the backplate and the diaphragm;
- a gap formed between the inner vibrating part and the outer part;
- wherein
- the inner vibrating part is provided with a first electrode pad electrically connected to a bias voltage, and the outer part is provided with a second electrode pad connected to the ground.
4 more elements
A silicon condenser microphone, comprising:
- a backplate having a plurality of perforations therethrough;
- a diaphragm opposed from the backplate for forming a capacitor, the diaphragm including a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate;
- a gap formed between the first part and the second part;
- wherein
- the first part is connected to the ground and the second part is connected to a bias voltage.
2 more elements
Dependencies are inferred from the claim text.