Combined multilayer circuit board having embedded components and manufacturing method of the same
AssigneeMutual-Tek Industries Co., Ltd.
InventorJung-Chien Chang
Life of this patent
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Abstract
A combined multilayered circuit board is provided. The combined multilayered circuit board includes a plurality of multilayered circuit boards, at least one of the plurality circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component. The internal chamber is full of air. The combined multilayered circuit board further includes at least one glue layer interposed between each of the plurality of multiple circuit boards for bonding the plurality of multilayered circuit boards together.
Claims15
A combined multilayered circuit board, comprising:
- a plurality of multilayered circuit boards, at least one of the plurality multilayered circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component, wherein the internal chamber is full of air and closed with no communication to atmosphere;
- and
- at least one glue layer interposing between each of the plurality of multilayered circuit boards for bonding the plurality of multilayered circuit boards together.
A combined multilayered circuit board, comprising:
- a plurality of multilayered circuit boards, at least one of the plurality of multilayered circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component;
- at least one glue layer interposed between each of the plurality of multilayered circuit boards for bonding the plurality of multilayered circuit boards together;
- and
- at least one air outlet on an outer surface of the combined multilayered circuit board, the air outlet communicating with the internal chamber.
A method of manufacturing a combined multilayered circuit board, comprising:
- providing a plurality of multilayered circuit boards, at least one of the plurality of multilayered circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component;
- providing at least one glue layer interposed between each of the plurality of multilayered circuit boards;
- pressing the glue layer with the plurality of multilayered circuit boards to bond the plurality of multilayered circuit boards together;
- and
- forming at least one air outlet on an outer surface of the combined multilayered circuit board, the air outlet communicating with the internal chamber.
A method of manufacturing a combined multilayered circuit board, comprising:
- providing a plurality of multilayered circuit boards, at least one of the plurality multilayered circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component, wherein the internal chamber is full of air and closed with no communication to atmosphere;
- and
- providing at least one glue layer interposed between each of the plurality of multilayered circuit boards for bonding the plurality of multilayered circuit boards together.
Dependencies are inferred from the claim text.