Optical element, optical element manufacturing method, and camera module

A camera module comprising:

• a semiconductor device including an imaging element;
• and
• a lens module that makes light from an outside incident on the imaging element, wherein
• the lens module includes:
• a substrate in which a through-hole is formed;
• a transparent thin film formed on at least one of a rear surface and a front surface of the substrate to cover the through-hole;
• and
• a lens formed in contact with a surface of the thin film in an area where the thin film covers the through-hole.

An optical element manufacturing method comprising:

• forming a transparent thin film formed on at least one of a rear surface and a front surface of a substrate;
• providing, leaving the thin film, a plurality of through-holes from a side of a surface of the substrate on which the thin film is not formed;
• forming a lens in contact with a surface of the thin film in an area where the thin film covers the through hole;
• and
• cutting the substrate on which the thin film and the lens are formed into predetermined size including the thin film and the lens.