Solder printing inspection apparatus and solder printing system

A solder printing inspection apparatus for inspection of solder printed on a circuit board having a multiplicity of lands for mounting of electronic components, the solder printing inspection apparatus comprising:

• an irradiation means capable of irradiation of a light on the circuit board;
• an imaging means capable of imaging the circuit board irradiated by the light;
• a solder bridge detection means capable of detection of a solder bridge connecting at least two of the lands based on an image data imaged by the imaging means;
• a detection means for extraction of two lands, solder printing regions, or solder inspection frames having a farthest positional relationship among at least two lands contacting a single solder bridge or a solder printing region or solder inspection frame set corresponding to such lands;
• a distance calculation means for calculation of, as a bridge distance, a minimum distance between the extracted two lands, solder printing regions, or solder inspection frames;
• a distance determination means for determination of whether or not the bridge distance is within a permissible range;
• and
• a severe defect processing means for performing a certain severe defect processing when the bridge distance is determined not to be within the permissible range.