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US 2011/0215970 A1Published application
High-frequency package
AssigneeKabushiki Kaisha Toshiba
InventorYasuaki ASAHI
Life of this patent
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Abstract
Certain embodiments provide a high-frequency package comprising: a conductive member to have a cut portion; a package to have a high-frequency device; a signal lead drawn from the package and is connected with the high-frequency device; a substrate to have a microstrip line comprising a microstrip line pattern in contact with the signal lead, a dielectric and an earth conductor; and a ground lead provided in the cut portion and directly below the signal lead, to contact the earth conductor and hold the substrate in cooperation with the signal lead.
Claims18
A high-frequency package comprising:
- a conductive member configured to have a surface, a recess provided on the surface, and a cut portion formed in the recess;
- a package configured to have a dielectric member surrounding a part of a space in the recess of the conductive member and a high-frequency device provided in the dielectric member;
- a signal lead configured to be drawn from the package and is connected with the high-frequency device;
- a substrate configured to have a microstrip line comprising a microstrip line pattern in contact with the signal lead and an earth conductor facing the microstrip line pattern through a dielectric and in contact with the surface of the conductive member;
- and
- a ground lead configured to be provided in the cut portion and directly below the signal lead, contact the earth conductor of the substrate and hold the substrate in cooperation with the signal lead.
3 more elements
A high-frequency package comprising:
- a conductive member configured to have a surface, a recess provided on the surface, and a cut portion formed in the recess;
- a dielectric member configured to surround a part of a space in the recess;
- a high-frequency device provided in the dielectric member;
- a package configured to have the dielectric member and the high-frequency device;
- a signal lead configured to be drawn from the package and is connected with the high-frequency device;
- a first microstrip line configured to comprise a first microstrip line pattern in contact with the signal lead, and a first earth conductor facing the first microstrip line pattern through a first dielectric and in contact with the surface of the conductive member;
- a substrate configured to have the first microstrip line;
- and
- a ground lead configured to be provided in the cut portion and directly below the signal lead, contact the first earth conductor and hold the substrate in cooperation with the signal lead.
6 more elements
Dependencies are inferred from the claim text.