Integrated Voltage Regulator with Embedded Passive Device(s)
AssigneeQUALCOMM Incorporated
InventorsYuancheng Christopher Pan, Lew G. Chua-Eoan, Zhi Zhu, Junmou Zhang
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Abstract
A method of supplying voltage to a die mounted on a packaging substrate includes mounting an active portion of a voltage regulator on the packaging substrate. The method also includes coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate and coupling the die to the at least one passive component. Mounting the active portion of the voltage regulator includes mounting the die on the packaging substrate where the die includes the active portion of the voltage regulator.
Claims18
A method of supplying voltage to a die mounted on a packaging substrate, the method comprising:
- mounting an active portion of a voltage regulator on the packaging substrate;
- coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate;
- and
- coupling the die to the at least one passive component.
A method of supplying power to a die, the method comprising:
- providing a supply voltage to an active portion of a voltage regulator mounted on a packaging substrate mounted on a printed circuit board;
- passing the supply voltage from the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate;
- passing the supply voltage from the at least one inductor to at least one capacitor at least partially embedded in the packaging substrate;
- and
- passing the supply voltage from the at least one capacitor to the die.
A method of supplying voltage to a die mounted on a packaging substrate, the method comprising the steps of:
- mounting an active portion of a voltage regulator on the packaging substrate;
- coupling the active portion of the voltage regulator to at least one passive component at least partially embedded in the packaging substrate;
- and
- coupling the die to the at least one passive component.
A method of supplying power to a die, the method comprising the steps of:
- providing a supply voltage to an active portion of a voltage regulator mounted on a packaging substrate mounted on a printed circuit board;
- passing the supply voltage from the active portion of the voltage regulator to at least one inductor at least partially embedded in the packaging substrate;
- passing the supply voltage from the at least one inductor to at least one capacitor at least partially embedded in the packaging substrate;
- and
- passing the supply voltage from the at least one capacitor to the die.
Dependencies are inferred from the claim text.