Semiconductor Package Test Apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorSoon-Geol Hwang
Life of this patent
Estimating the term…
Abstract
A semiconductor package test apparatus having a test head and a test handler is provided. The semiconductor package test apparatus may include an insert in which a plurality of semiconductor packages are stacked and received in an offset fashion. Further, the semiconductor package test apparatus may include a plurality of sockets located adjacent to the insert and each of the inserts may have a plurality of socket pins. The sockets have different surface levels and are aligned with the semiconductor packages.
Claims20
A semiconductor package test apparatus, comprising:
- an insert configured to support a plurality of semiconductor packages in an offset fashion;
- and
- a plurality of sockets adjacent to the insert, each of the sockets having a plurality of socket pins, wherein the sockets are configured for alignment with the semiconductor packages and the sockets have different surface levels.
A semiconductor test handler comprising:
- a test tray configured to support a plurality of inserts;
- and
- a loader adjacent to the test tray,
- wherein each insert is configured to support a plurality of semiconductor packages stacked therein in an offset fashion.
A semiconductor package test apparatus, comprising:
- an insert configured to support a first semiconductor package and a second semiconductor package, the insert configured to support the second semiconductor package and the first semiconductor package such that at least a portion of the second semiconductor is exposed by the first semiconductor package;
- a first socket including a first plurality of socket pins configured to contact the first semiconductor package, the first plurality of socket pins including first ends at a first surface level;
- and
- a second socket including a second plurality of socket pins configured to contact the second semiconductor package, the second plurality of socket pins including second ends at a second surface level which is different from the first surface level.
Dependencies are inferred from the claim text.