Led package structure for increasing light-emitting efficiency

An LED package structure for increasing light-emitting efficiency, comprising:

• a heat-dissipating unit having at least one heat-dissipating substrate;
• an insulating unit having at least one insulating layer formed on the at least one heat-dissipating substrate and at least one receiving groove passing through the at least one insulating layer and formed above the at least one heat-dissipating substrate, wherein the at least one insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the at least one insulating layer is an annular inclined surface in the at least one receiving groove;
• a heat-conducting unit having at least one heat-conducting layer formed on the at least one heat-dissipating substrate and on the annular inclined surface of the at least one insulating layer, wherein the at least one heat-conducting layer has a receiving groove formed on a top surface thereof and above the at least one receiving groove of the insulating unit and an annular inclined surface formed above the annular inclined surface of the at least one insulating layer;
• a light-emitting unit having at least one light-emitting element disposed on the at least one heat-conducting layer and received in the at least one receiving groove of the at least one heat-conducting layer;
• and
• a conductive unit having at least two conductive structures disposed on the at least one insulating layer and separated from each other, wherein the at least one light-emitting element is electrically connected between the at least two conductive structures.

An LED package structure for increasing light-emitting efficiency, comprising:

• a heat-dissipating unit having at least one heat-dissipating substrate;
• an insulating unit having at least one insulating layer formed on the at least one heat-dissipating substrate and at least one receiving groove passing through the at least one insulating layer and formed above the at least one heat-dissipating substrate, wherein the at least one insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the at least one insulating layer is an annular inclined surface in the at least one receiving groove;
• a heat-conducting unit having at least one heat-conducting structure formed on the at least one heat-dissipating substrate and on the annular inclined surface of the at least one insulating layer, wherein the at least one heat-conducting structure is composed of at least two heat-conducting layers, and the at least one heat-conducting structure has a receiving groove formed on a top surface thereof and above the at least one receiving groove of the insulating unit and an annular inclined surface formed above the annular inclined surface of the at least one insulating layer;
• a light-emitting unit having at least one light-emitting element disposed on the at least one heat-conducting structure and received in the at least one receiving groove of the at least one heat-conducting structure;
• and
• a conductive unit having at least two conductive structures disposed on the at least one insulating layer and separated from each other, wherein the at least one light-emitting element is electrically connected between the at least two conductive structures.