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AssigneeApple Inc.
InventorsDaniel W. Jarvis, Stephen Paul Zadesky, Pinida Jan Moolsintong, Tang Tew Tan
Estimating the term…
Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
A method for assembling a device housing of an electronic device, said method comprising:
An electronic device having a device housing including an outer housing member, the device housing being formed by the method of:
An electronic device enclosure, comprising:
A method for assembling a device housing of an electronic device, said method comprising:
Dependencies are inferred from the claim text.