Molding method and molding apparatus
AssigneeSeiko Epson Corporation
InventorsEiji OKAMOTO, Toshimitsu HIRAI, Kohei ISHIDA
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AssigneeSeiko Epson Corporation
InventorsEiji OKAMOTO, Toshimitsu HIRAI, Kohei ISHIDA
Estimating the term…
A molding method includes: drawing cross-section elements of a three-dimensional object as a molding target on a drawing surface of a drawing stand with a liquid whose curing is precipitated by receiving activation energy as cross-section patterns; applying the activation energy to the liquid configuring the cross-section patterns in a state in which the cross-section patterns is pinched between the drawing stand and a molding stand; and detaching the cross-section patterns after being applied with the activation energy from the drawing stand and transferring the cross-section patterns to the molding stand side, wherein the drawing surface has a liquid repellent area that is an area representing liquid repellency for the liquid and a lyophilic area that is independently formed in an island shape within the liquid repellent area and is an area representing lyophillicity stronger than that of the liquid repellent area for the liquid.
A molding method comprising:
A molding apparatus comprising:
Dependencies are inferred from the claim text.