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US 2011/0215484 A1Published application
Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like
AssigneeUPEK, Inc.
InventorsRobert Bond, Alan Kramer, Giovanni Gozzini
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Abstract
A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
Claims21
A fingerprint sensor device, comprising:
- a substrate having a first side and a second side;
- a die having formed therein fingerprint sensing circuitry, said die secured to a die-receiving region of said first side of said substrate;
- a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region;
- and
- an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel.
2 more elements
A fingerprint sensor assembly comprising:
- a substrate having a first side and a second side;
- a die having formed thereon a fingerprint sensing array, said die secured to a die-receiving region of said first side of said substrate;
- a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region;
- a second conductive bezel secured to a second bezel-receiving region of said first side of said substrate proximate said die-receiving region, such that said die receiving region is between said first and second bezel-receiving regions;
- and
- an encapsulation structure integrally encapsulating said die, said first conductive bezel, and said second conductive bezel, said encapsulation structure substantially encasing said die and said first and second conductive bezels such that only said fingerprint sensing array and a portion of a top surface of each of said first conductive bezel and said second conductive bezel are not encased by said encapsulation structure and are exposed for physical contact.
3 more elements
Dependencies are inferred from the claim text.