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US 2011/0215481 A1Published application
Semiconductor device
AssigneePanasonic Corporation
InventorsNoriyuki Nagai, Toshihiko Sakashita
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Abstract
In a semiconductor device, a pad metal has at least a portion located immediately under a probe region, and the portion is divided into a plurality of narrow metal layers each arranged in parallel with a traveling direction of a probe. Thus, it is possible to enhance surface flatness of the pad metal and to prevent a characteristic of a semiconductor device from deteriorating without complication in processing and increase in chip size.
Claims10
-18. (canceled)
A semiconductor device comprising:
- an electrode pad region having an electrode pad formed thereon and serving as an external terminal for proving;
- an active region having an internal circuit formed therein;
- a plurality of metal wires located under the electrode pad;
- and
- a via for electrically connecting between the electrode pad and one of the metal wires,
- wherein a slit is between the metal wires, the slit extends in a direction from the electrode pad region to the active region, and the via extends in a direction perpendicular to the slit.
3 more elements
Dependencies are inferred from the claim text.