Semiconductor element-embedded wiring substrate

A wiring substrate containing a semiconductor element, the wiring substrate comprising:

• a supporting substrate;
• a semiconductor element provided on the supporting substrate;
• a peripheral insulating layer provided on the supporting substrate and covering at least an outer circumferential side surface of the semiconductor element;
• and
• upper surface-side wiring provided on the upper surface side of the wiring substrate,
• the semiconductor element comprising:
• a semiconductor substrate;
• a first wiring-structure layer comprising first wiring and a first insulating layer alternately formed on the semiconductor substrate;
• and
• a second wiring-structure layer comprising second wiring and a second insulating layer alternately formed on the first wiring-structure layer,
• wherein the upper surface-side wiring comprises fan-out wiring led out from immediately above the semiconductor element to a peripheral region external to an outer edge of the semiconductor element, the fan-out wiring being electrically connected to the first wiring through the second wiring;
• the thickness of the second wiring is greater than the thickness of the first wiring but less than the thickness of the upper surface-side wiring;
• and
• the second insulating layer is formed of a resin material and greater in thickness than the first insulating layer.