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US 2011/0215475 A1Published application
Multi-surface ic packaging structures
AssigneeInterconnect Portfollo LLC
InventorsJoseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, Kevin P. Grundy
Life of this patent
Estimating the term…
Abstract
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
Claims11
(canceled)
An integrated circuit (IC) package assembly for space transforming the input/output (I/O) terminals from locations on at least one IC chip within the package assembly to I/O terminal locations distal from the chip comprising:
- discrete interconnecting conductors which are attached to a chip and distend directly to locations that serve as I/O terminals for the IC package;
- an insulation material surrounding, supporting, insulating and separating the discrete interconnecting elements;
- and wherein the I/O terminals for the IC package are on multiple step levels of the package assembly.
Dependencies are inferred from the claim text.