Through Silicon via Bridge Interconnect
AssigneeQUALCOMM Incorporated
InventorArvind Chandrasekaran
Life of this patent
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Abstract
An integrated circuit bridge interconnect device includes a first die and a second die provided in a side-by-side configuration and electrically interconnected to each other by a bridge die. The bridge die includes through silicon vias (TSVs) to connect conductive interconnect lines on the bridge die to the first die and the second die. Active circuitry, other than interconnect lines, may be provided on the bridge die. At least one or more additional die may be stacked on the bridge die and interconnected to the bridge die.
Claims20
A bridge die, comprising:
- through vias;
- and
- a conductive layer coupled to the through vias, the conductive layer and the through vias electrically coupling a first die to a second die.
An integrated circuit package comprising:
- a first die disposed on a substrate;
- a second die disposed on the substrate;
- and
- a bridge die interconnecting the first die to the second die, the bridge die comprising conductive through vias coupled to conductive lines on a first side of the bridge die to enable the interconnecting.
An integrated circuit package comprising:
- a first die disposed on a substrate;
- a second die disposed on the substrate;
- and
- means for interconnecting the first die to the second die, the interconnecting means comprising conductive through vias coupled to conductive lines on a first side of the interconnecting means to enable the interconnecting.
Dependencies are inferred from the claim text.