Package On Package
AssigneeSamsung Electronics Co., Ltd.
InventorsWoo-Jae Kim, Young-Hoon Ro, Sung-Woo Park
Life of this patent
Estimating the term…
Abstract
A package on package structure is provided. The package on package structure may include a first substrate having a first center region and a first C-shaped edge region at a first end of the first center region. In example embodiments, the first C-shaped edge region may faun a first space. The package structure may further include at least two first connection pads on an inner surface of the first C-shaped edge region and the at least two first connection pads may be arranged to face one another. In example embodiments, at least one first solder ball may be arranged in the first space and the at least one first solder ball may be connected to the at least two first connection pads.
Claims20
A package structure comprising:
- a first substrate having a first center region and a first C-shaped edge region at a first end of the first center region, the first C-shaped edge region forming a first space;
- at least two first connection pads on an inner surface of the first C-shaped edge region;
- and
- at least one first solder ball in the first space, the at least one first solder ball connected to the at least two first connection pads.
Dependencies are inferred from the claim text.