Metal post chip connecting device and method free to use soldering material

Abstract

A metal post chip connecting device without soldering materials is revealed, primarily comprising a chip and a substrate. A plurality of metal pillars are disposed on and extruded from a surface of the chip where each metal pillar has an end surface and two corresponding parallel sidewalls. The substrate has an upper surface and a plurality of bonding pads disposed on the upper surface where each bonding pad has a concaved bottom surface and two corresponding concaved sidewalls. The chip is bonded onto the upper surface of the substrate through heat, pressure, and ultrasonic power so that the end surfaces of the metal pillars self-solder to the concaved bottom surfaces and two parallel sidewalls of the metal pillars partially self-solder to two concaved sidewalls to form U-shape cross-sections of metal bonding between the metal pillars and the bonding pads. Therefore, there is no need for the conventional solder paste as chip connection to increase conductivity of the soldering points, especially, to save the soldering cost for MPS-C2 products and to greatly enhance the bonding strength of the soldering points. The manufacturing method of the above described metal post chip connecting device is also revealed.

Dependencies are inferred from the claim text.