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US 2011/0215464 A1Published application
Semiconductor package with embedded die and its methods of fabrication
AssigneeIntel Corporation
InventorsJohn Stephen Guzek, Javier Soto Gonzalez, Nicholas R. Watts, Ravi K. Nalla
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Abstract
Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.
Claims21
A method of forming a semiconductor package comprising:
- providing a carrier having a conductive surface;
- forming a first dielectric layer on the conductive surface of the carrier, the first dielectric layer having a die cavity exposing a die region on the conductive surface;
- forming a layer of adhesive on the die region of the conductive surface;
- attaching a die onto the layer of adhesive, the die having a back side secured to the layer of adhesive, and a front side having a plurality of die pads;
- depositing a second dielectric layer onto the first dielectric layer and the die;
- forming a plurality of die interconnects on the plurality of die pads at the front side of the die;
- and
- removing the carrier to expose the layer of adhesive.
5 more elements
A semiconductor package comprising:
- a first package comprising:
- a first dielectric layer having a top surface, and a cavity extended through the first dielectric layer;
- a layer of adhesive formed in the cavity of the first dielectric layer, the layer of adhesive having an upper surface and a lower surface, wherein the upper surface is substantially coplanar to the top surface of the first dielectric layer;
- a first die formed in the cavity, the first die having a front side and a back side, wherein the front side includes a plurality of die pads, and wherein the back side is adhered to the lower surface of the layer of adhesive;
- a second dielectric layer formed over the bottom surface of the first dielectric layer and over the front side of the first die;
- and
- a plurality of die interconnects electrically coupled to the plurality of die pads on the front side of the first die.
4 more elements
Dependencies are inferred from the claim text.