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US 2011/0215461 A1Published application
Method for manufacturing a semiconductor device and a semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorToshitsune IIJIMA
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Abstract
A method for manufacturing a semiconductor device according to one embodiment of the present invention includes a step of covering a plurality of base plates in which respective semiconductor chips are mounted, by means of a sealing resin such that a plurality of base plates are spaced apart from each other, and a step of cutting the sealing resin between a plurality of base plates.
Claims20
A method for manufacturing a semiconductor device comprising steps of:
- pasting to a support body a plurality of base plates on which respective semiconductor chips are mounted, at a predetermined interval;
- forming a sealing resin in the support body such that the sealing resin covers the plurality of base plates and a plurality of the semiconductor chips;
- forming wiring patterns in the sealing resin such that the wiring patterns are electrically connected to the respective semiconductor chips;
- forming wiring protective film in the sealing resin including the wiring patterns such that part of the wiring patterns are exposed;
- forming external electrodes such that the external electrodes contact the wiring patterns exposed from the wiring protective film;
- cutting the sealing resin and the wiring protective film;
- and
- peeling off from the support body the semiconductor chips and the base plates covered by the sealing resin.
5 more elements
A method for manufacturing a semiconductor device comprising steps of:
- pasting to a support body a plurality of base plates on which respective semiconductor chips are mounted, at a predetermined interval;
- forming a sealing resin in the support body such that the sealing resin covers the plurality of base plates and a plurality of the semiconductor chips;
- forming in the sealing resin gaps from which lateral surfaces of the base plates are exposed;
- forming wiring patterns in the sealing resin such that the wiring patterns are electrically connected to the respective semiconductor chips;
- forming wiring protective film in the sealing resin including the wiring patterns such that part of the wiring patterns are exposed;
- forming external electrodes such that the external electrodes contact the wiring patterns exposed from the wiring protective film;
- and
- peeling off from the support body the semiconductor chips and the base plates covered by the sealing resin.
5 more elements
A semiconductor device comprising:
- a semiconductor chip;
- a base plate which contacts an upper surface of the semiconductor chip;
- a sealing resin which is formed to cover lateral surfaces and a lower surface of the base plate and cover the semiconductor chip;
- a wiring pattern which is formed in a lower surface of the sealing resin to be electrically connected to the semiconductor chip;
- a wiring protective film which is formed in the lower surface of the sealing resin including the wiring pattern such that part of the wiring pattern is exposed;
- and
- an external electrode which is formed to contact the wiring pattern exposed from the wiring protective film.
4 more elements
Dependencies are inferred from the claim text.