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US 2011/0215460 A1Published application
Stacked semiconductor chips
AssigneeInfineon Technologies AG
InventorsRalf Otremba, Josef Hoeglauer, Xaver Schloegel, Soon Hock Tong, Kwai Hong Wong
Life of this patent
Estimating the term…
Abstract
Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body. The first external contact elements and the second external contact elements define a first plane.
Claims22
A device, comprising:
- a first body comprising a first power semiconductor chip and first external contact elements;
- and
- a second body comprising a second semiconductor chip and second external contact elements, wherein
- the second external contact elements comprise solder deposits,
- the second body is placed over the first body, and
- the first external contact elements and the solder deposits define a first plane.
3 more elements
A device, comprising:
- a first body comprising a first encapsulation embedding a first power semiconductor chip and having first external contact elements;
- and
- a second body comprising a second encapsulation embedding a second semiconductor chip and having second external contact elements, wherein
- the second external contact elements are solder balls,
- the second body is placed over the first body,
- the first and second encapsulations are separate from one another,
- the first external contact elements and the solder balls are electrically isolated from each other and define a first plane, and
- the first power semiconductor chip has a first electrode on a first main surface and a second electrode on a second main surface opposite the first main surface.
5 more elements
A device, comprising:
- a circuit board;
- a first body comprising a first power semiconductor chip placed over the circuit board;
- a second body comprising a second semiconductor chip placed over the first body;
- and
- solder deposits extending from the circuit board to the second body.
2 more elements
Dependencies are inferred from the claim text.