Interconnect and test assembly including an interconnect
AssigneeYamaichi Electronics U.S.A., Inc.
InventorsJesus S. Sangalang, Kazuya Takahashi
Life of this patent
Estimating the term…
Abstract
An interconnect includes an elastic body, an electric conductor and a spacer. The elastic body has a first surface, a second surface, a first hole extending from the first surface to the second surface, and a second hole extending from the first surface to the second surface. The electric conductor is disposed in the first hole of the insulating body for contacting one of a plurality of balls of the first integrated circuit package and one of a plurality of conductor pads of the second integrated circuit package. The electric conductor includes an elastic body and electric conductor particles disbursed in the elastic body. The spacer is disposed in the second hole.
Claims20
An interconnect comprising:
- an elastic body having
- a first surface,
- a second surface,
- a first hole extending from the first surface to the second surface, and
- a second hole extending from the first surface to the second surface;
- an electric conductor disposed in the first hole of the insulating body for contacting one of a plurality of balls of the first integrated circuit package and one of a plurality of conductor pads of the second integrated circuit package, the electric conductor including
- an elastic body, and
- electric conductor particles disbursed in the elastic body;
- and
- a spacer disposed in the second hole.
A test assembly comprising:
- a first integrated circuit package including a BGA;
- a second integrated circuit package including a plurality of conductor pads and a BGA;
- and
- an interconnect including
- an elastic body having
- a first surface for contacting the first integrated circuit package,
- a second surface for contacting the second integrated circuit package,
- a first hole extending from the first surface to the second surface, and
- a second hole extending from the first surface to the second surface,
- an electric conductor disposed in the first hole of the insulating body for contacting one of the balls of the first integrated circuit package and one of the conductor pads of the second integrated circuit package, the electric conductor including
- an elastic body, and
- electric conductor particles disbursed in the elastic body, and
- a spacer disposed in the second hole.
A test assembly comprising:
- a socket lid assembly;
- a first integrated circuit package including a BGA;
- a second integrated circuit package including a plurality of conductor pads and a BGA;
- a motherboard;
- a first interconnect including
- an elastic body having
- a first surface for contacting the first integrated circuit package,
- a second surface for contacting the second integrated circuit package,
- a first hole extending from the first surface to the second surface, and
- a second hole extending from the first surface to the second surface,
- an electric conductor disposed in the first hole of the insulating body for contacting one of the balls of the first integrated circuit package and one of the conductor pads of the second integrated circuit package, the electric conductor including
- an elastic body, and
- electric conductor particles disbursed in the elastic body, and
- a spacer disposed in the second hole;
- a second interconnect including
- an elastic body having
- a first surface for contacting the second integrated circuit package,
- a second surface for contacting the motherboard,
- a hole extending from the first surface to the second surface, an electric conductor disposed in the hole of the insulating body for contacting one of the balls of the second integrated circuit package and one of the conductor pads of the mother board, the electric conductor including
- an elastic body, and
- electric conductor particles disbursed in the elastic body;
- a socket bottom for receiving the second package, wherein the socket bottom is releasably connected to the motherboard;
- an lock mechanism that interlocks and compresses the socket lid assembly, first integrated circuit package, first interconnect, second integrated circuit package, second interconnect, and motherboard against one another;
- and
- guide pins that align the socket lid assembly, first integrated circuit package, first interconnect, second integrated circuit package, second interconnect, and motherboard.
Dependencies are inferred from the claim text.