Thin package system with external terminals and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsYoungcheol Kim, Myung Kil Lee, Gwang Kim, Koo Hong Lee
Life of this patent
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Abstract
A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.
Claims20
A method of manufacture of a thin package system with external terminals, comprising:
- providing a leadframe;
- providing a template for defining an external bond finger;
- forming external bond fingers in the template on the leadframe;
- forming land pad terminals by a first multi-layer plating;
- providing a die;
- attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe;
- covering an encapsulant over at least portions of the die and the external bond fingers;
- and
- removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.
A method of manufacture of a thin package system with external terminals, comprising:
- providing a leadframe;
- forming a resist on the leadframe, the resist having openings therethrough;
- plating external bond fingers on the leadframe in the openings through the resist;
- removing the resist;
- forming land pad terminals by a first multi-layer plating;
- providing a die having terminal pads;
- attaching the die to the land pad terminals above the leadframe with an adhesive;
- wire bonding the die to the external bond fingers with gold stud bumps connecting leadframe wires to the terminal pads on the die and gold stud bumps connecting the leadframe wires to the external bond fingers;
- covering an encapsulant over at least portions of the die and the external bond fingers;
- and
- dissolving the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.
A thin package system with external terminals, comprising:
- external bond fingers having the characteristics of having been formed on a leadframe by a template;
- land pad terminals having a first multi-layer plating, adjacent to the external bondfingers;
- a die on the land pad terminals having the characteristics of having been attached to the leadframe;
- an adhesive around the land pad terminals and under the die;
- and
- an encapsulant over at least portions of the die and the external bond fingers, a surface of adhesive coplanar with a surface of the encapsulant.
Dependencies are inferred from the claim text.