Semiconductor package, substrate, electronic component, and method of mounting semiconductor package

A substrate comprising:

• an internal ground electrode formed in the one side of said substrate;
• two external ground electrodes, located at the opposite side of said substrate opposite to said one side, which are electrically connected to said internal ground electrode;
• at least one sub-ground electrode, located between said two external ground electrodes, when seen in a plan view, and located at the opposite side of said substrate, which is electrically connected to said internal ground electrode;
• an internal input electrode formed in said one side of said substrate;
• and
• an internal output electrode formed in said one side of said substrate.

An electronic component comprising:

• a mounting substrate;
• and
• a semiconductor package mounted over said mounting substrate,
• wherein said semiconductor package includes:
• a semiconductor device;
• and
• a substrate over which said semiconductor device is mounted, and
• wherein said substrate includes:
• an internal ground electrode, formed in the one side of said substrate, which is connected to said semiconductor device;
• two external ground electrodes, located at the opposite side of said substrate opposite to said one side, which are electrically connected to said internal ground electrode;
• at least one sub-ground electrode, located between said two external ground electrodes, when seen in a plan view, and located at said opposite side of said substrate, which is electrically connected to said internal ground electrode;
• an internal input electrode, formed in said one side of said substrate, which is connected to said semiconductor device;
• and
• an internal output electrode, formed in said one side of said substrate, which is connected to said semiconductor device, and
• wherein said internal ground electrode is connected to said mounting substrate through said two external ground electrodes and said sub-ground electrode.

A method of mounting a semiconductor package, comprising:

• mounting the semiconductor package over a mounting substrate,
• wherein said semiconductor package includes:
• a semiconductor device;
• and
• a substrate over which said semiconductor device is mounted, and
• wherein said substrate includes:
• an internal ground electrode, formed in the one side of said substrate, which is connected to said semiconductor device;
• two external ground electrodes, located at the opposite side of said substrate opposite to said one side, which are electrically connected to said internal ground electrode;
• at least one sub-ground electrode, located between said two external ground electrodes, when seen in a plan view, and located at said opposite side of said substrate, which is electrically connected to said internal ground electrode;
• an internal input electrode, formed in said one side of said substrate, which is connected to said semiconductor device;
• and
• an internal output electrode, formed in said one side of said substrate, which is connected to said semiconductor device, and
• wherein in said mounting the semiconductor package, said internal ground electrode is connected to the mounting substrate through said two external ground electrodes and said sub-ground electrode.