Integrated circuit package system with package stacking and method of manufacture thereof

A method of manufacture of an integrated circuit package system comprising:

• providing a base package substrate including:
• forming component contacts on a component side of the base package substrate,
• forming system contacts on a system side of the base package substrate, and
• forming a reference voltage circuit between the component contacts and the system contacts by coupling two adjacent units of the component contacts to the closest unit of the system contacts;
• mounting a first integrated circuit die on the component contacts including coupling a chip interconnect to one of the component contacts of the reference voltage circuit;
• mounting a lead frame on the first integrated circuit die and coupled to the component contacts including applying a conductive adhesive between the lead frame and one of the component contacts of the reference voltage circuit;
• and
• isolating a conductive shield from the lead frame by sawing, grinding or etching including having the conductive shield coupled to the reference voltage circuit includes isolating pillar interconnects from the lead frame.

An integrated circuit package system comprising:

• a base package substrate including:
• component contacts on a component side of the base package substrate,
• system contacts on a system side of the base package substrate, and
• a reference voltage circuit connected between the component contacts and the system contacts;
• a first integrated circuit die mounted on the component contacts;
• and
• a conductive shield mounted directly on the first integrated circuit die includes the conductive shield coupled to the reference voltage circuit through the component contacts.