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US 2011/0215438 A1Published application
Stacked Semiconductor Package Having Discrete Components
AssigneeMicron Technology, Inc.
InventorsChua Swee Kwang, Chia Yong Poo
Life of this patent
Estimating the term…
Abstract
A stacked semiconductor package includes a substrate and a plurality of semiconductor dice stacked on the substrate. Each semiconductor die includes a recess, and a discrete component contained in the recess encapsulated in a die attach polymer. The stacked semiconductor package also includes interconnects electrically connecting the semiconductor dice and discrete components, and an encapsulant encapsulating the dice and the interconnects.
Claims20
A stacked semiconductor package comprising:
- a substrate having a plurality of contacts;
- a plurality of semiconductor dice on the substrate in a stacked array in electrical communication with at least one contact on the substrate, each semiconductor die comprising a recess, at least one discrete component in the recess in electrical communication with the semiconductor die, and a polymer encapsulating the discrete component in the recess and attaching the semiconductor die to the substrate or to an adjacent semiconductor die of the stacked array;
- a plurality of interconnects in electrical communication with the semiconductor dice and the contacts;
- and
- an encapsulant on the substrate encapsulating the semiconductor dice and the interconnects.
2 more elements
A stacked semiconductor package comprising:
- a substrate having a plurality of terminal contacts;
- a semiconductor die mounted to the substrate comprising a semiconductor substrate having a back side, a recess in the semiconductor substrate on the back side, at least one discrete component embedded in the semiconductor substrate of the semiconductor die within the recess, a die attach polymer encapsulating the discrete component in the recess and attaching the semiconductor die to the substrate;
- at least one second semiconductor die stacked on the semiconductor die having a plurality of second recesses and at least one second discrete component encapsulated by a second die attach polymer attaching the second semiconductor die to the semiconductor die;
- and
- a plurality of interconnects establishing electrical communication between the first semiconductor die and the second semiconductor die and the terminal contacts.
2 more elements
A stacked semiconductor package comprising:
- a substrate having a plurality of contacts;
- a semiconductor die on the substrate having a recess and a plurality of integrated circuits in electrical communication with the contacts on the substrate;
- at least one discrete component in the recess in electrical communication with the integrated circuits and with the contacts on the substrate;
- a die attach polymer attaching the semiconductor die to the substrate and encapsulating the discrete component in the recess;
- and
- a second semiconductor die stacked on the semiconductor die having a second recess and at least one second discrete component in electrical communication with the contacts on the substrate encapsulated by a second die attach polymer attaching the second semiconductor die to the semiconductor die.
3 more elements
Dependencies are inferred from the claim text.