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AssigneeTronics Microsystems S.A.
InventorsPhilippe Azoley, Jean-Michel Gilet, Stéphane Nicolas
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A micro-electromechanical component produced from a semiconductor substrate, comprising an internal moving portion which includes conductive elements and contacts on its outer surface, said contacts being electrically connected to said conductive elements, said electrical contacts being capable of accommodating soldered interconnect wires which are themselves designed to be connected to electrical contacts provided on device which accommodates said component, characterized in that electrical contacts are arranged in an area which extends between upper face of the component and lateral face, said contacts having a concave shape and having two regions capable of accommodating soldered interconnect wires, said regions being substantially perpendicular to each other and parallel to said upper face and said lateral face respectively.
Micro-electromechanical component produced from a semiconductor substrate, comprising an internal moving portion which includes conductive elements and contacts on its outer surface, said contacts being electrically connected to said conductive elements, said electrical contacts being capable of accommodating soldered interconnect wires which are themselves designed to be connected to electrical contacts provided on device which accommodates said component, characterized in that electrical contacts are arranged in an area which extends between upper face of the component and lateral face, said contacts having a concave shape and having two regions capable of accommodating soldered interconnect wires, said regions being substantially perpendicular to each other and parallel to said upper face and said lateral face respectively.
Method of fabricating micro-electromechanical components from a wafer of a semiconductor material, each component comprising an internal moving portion which includes conductive elements, and contacts on its outer face, said contacts being electrically connected to said conductive elements, the contacts being designed to accommodate soldered conducting wires allowing connection to electrical contacts of other components, characterized in that it comprises the following steps:
Dependencies are inferred from the claim text.