Manufacturing method of electronic device package, electronic device package, and oscillator

A method for producing electronic device packages each containing an electronic device inside, comprising:

• (a) defining a plurality of first substrates on a first wafer and a plurality of second substrates on a second wafer;
• (b) forming a bonding film on a respective opposite surfaces of the second wafer, wherein the bonding films on the opposing surfaces are electrically connected to each other;
• (c) layering, between boding electrodes, the first and second wafers such that at least some of the first substrates substantially coincide respectively with at least some of the corresponding second substrates, with the bonding film being placed between a respective at least some of the coinciding first and second substrates, wherein one of the bonding electrodes on the second wafer is in electrical contact with the bonding films;
• (d) anodically bonding the first and second substrates by applying a bonding voltage across the bonding electrodes;
• and
• (e) cutting off a respective at least some of packages made of coinciding first and second substrates.