Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsWataru SAITO, Syotaro Ono, Munehisa Yabuzaki, Shunji Taniuchi, Miho Watanabe
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsWataru SAITO, Syotaro Ono, Munehisa Yabuzaki, Shunji Taniuchi, Miho Watanabe
Estimating the term…
According to one embodiment, a semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of the first conductivity type, a first main electrode, a third semiconductor region of a second conductivity type, a second main electrode, and a plurality of embedded semiconductor regions of the second conductivity type. The second semiconductor region is formed on a first major surface of the first semiconductor region. The first main electrode is formed on a face side opposite to the first major surface of the first semiconductor region. The third semiconductor region is formed on a second major surface of the second semiconductor region on a side opposite to the first semiconductor region. The second main electrode is formed to bond to the third semiconductor region. The embedded semiconductor regions are provided in a termination region. A distance between the embedded semiconductor region and the second major surface along a direction from the second major surface toward the first major surface becomes longer toward outside from the device region.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.