Electronic devices with improved ohmic contact
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorHacène Lahreche
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Abstract
In one embodiment, the disclosure relates to an electronic device successively comprising from its base to its surface: (a) a support layer, (b) a channel layer adapted to contain an electron gas, (c) a barrier layer and (d) at least one ohmic contact electrode formed by a superposition of metallic layers, a first layer of which is in contact with the barrier layer. The device is remarkable in that the barrier layer includes a contact region under the ohmic contact electrode(s). The contact region includes at least one metal selected from the metals forming the superposition of metallic layers. Furthermore, a local alloying binds the contact region and the first layer of the electrode(s).
Claims8
An electronic device successively comprising from its base to its surface:
- a) a support layer;
- b) a channel layer adapted to contain an electron gas;
- c) a barrier layer;
- d) at least one ohmic contact electrode formed by a superposition of non alloyed metallic layers a first layer of which is in contact with the barrier layer, wherein the barrier layer includes a contact region disposed under the at least one ohmic contact electrode, and further wherein the contact region includes at least one metal selected from the group of metals from which the ohmic contact electrode is formed.
Dependencies are inferred from the claim text.