Light-emitting diode with wire-piercing lead frame
AssigneeWillis Electric Co., Ltd.
InventorJohnny Chen
Life of this patent
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Abstract
A wire-piercing light-emitting diode (LED) a lead frame having a first lead and a second lead. The first lead has a first transition portion and a first bottom portion with a first cutting member, and the second lead having a second transition portion and a second bottom portion with a second cutting member.
Claims45
A light-emitting diode (LED) lead frame for piercing wires having conductors surrounded by insulating material, thereby making electrical contact between the lead frame and the wires, the LED lead frame comprising:
- a first lead including a top portion that receives an LED and a bottom portion having at least one cutting member for piercing a first wire;
- and
- a second lead including a top portion and a bottom portion with at least one cutting member for piercing a second wire;
- and
- wherein the first lead and the second lead are spaced apart by a predetermined distance.
A light-emitting diode (LED) lead frame for supporting an LED and piercing wires having conductors surrounded by insulating material, thereby making electrical contact between the lead frame and the wires, the LED lead frame comprising:
- a first lead including means for supporting an LED at a top portion of the first lead, and means for piercing the insulation of a first wire;
- a second lead including means for piercing the insulation of a second wire;
- and
- means for electrically connecting the first lead to the second lead through the LED.
A light-emitting diode (LED) lead frame for supporting an LED and piercing wires having conductors surrounded by insulating material, thereby making electrical contact between the lead frame and the wires, the LED lead frame comprising:
- a first lead including a first transition portion forming a first shoulder, a first pair of cutting members, and defining a first wire-receiving recess, the first shoulder extending outward and away from the first pair of cutting members;
- and
- a second lead including a second transition portion forming a second shoulder, a second pair of cutting members, and defining a second wire-receiving recess, the second shoulder extending outward and away from the second pair of cutting members.
A light-emitting diode (LED) lead frame for piercing wires having conductors surrounded by insulating material, comprising:
- a first lead including a top portion and a bottom portion, the bottom portion having a cutting member for piercing a first wire, the cutting member defining a first wire-receiving channel;
- and
- a second lead including a top portion having a surface supporting an LED chip carrier and defining a horizontal plane, and a bottom portion, the bottom portion having at least one cutting member for piercing a second wire, the cutting member defining a second wire-receiving channel;
- and
- wherein the bottom portion of the first lead and the bottom portion of the second lead are coplanar and substantially perpendicular to the horizontal plane supporting the chip carrier.
A method of manufacturing a wire-piercing lead frame having first and second leads, comprising:
- forming a light-emitting diode chip carrier on a top surface of a lead-frame carrier, the lead frame carrier comprising a planar strip of conductive material;
- stamping out a first portion of the lead frame carrier to form a first lead of a wire-piercing lead frame, the first lead including a first cutting member, the first cutting member attached to the lead frame carrier at an end of the first cutting member;
- stamping out a second portion of the lead frame carrier to form a second lead of a wire-piercing lead frame, the first lead including the LED chip carrier at a top portion and a first cutting member at a bottom portion, the second cutting member attached to the lead frame carrier at an end of the second cutting member;
- separating the first lead and the second lead from the lead-frame carrier, thereby forming an LED lead frame having a first lead and a second lead.
A method of manufacturing a wire-piercing lead frame, comprising:
- stamping out a first portion of a lead frame carrier to form a first lead of a wire-piercing lead frame, the first lead including a top portion and a bottom portion;
- stamping out a second portion of the lead frame carrier to form a second lead of a wire-piercing lead frame, the first lead including a top portion and a bottom portion, the top portion having an LED chip carrier, and wherein the top portion of the second lead is adjacent the top portion of the first lead;
- bending the first lead such that the top portion is substantially perpendicular to the bottom portion of the first lead;
- and
- bending the second lead such that the top portion is substantially perpendicular to the bottom portion of the second lead and the top portion of the second lead is coplanar to the top portion of the first lead.
Dependencies are inferred from the claim text.