Light emitting device

Abstract

A light emitting device (1) includes a glass substrate (4) having a recess (2) in a front surface, and a lead frame (5a). A copper material (7) is embedded so that the copper material (7) passes through the lead frame (5a). A light emitting element (6) is mounted on the copper material (7). The glass substrate (4) and the lead frame (5a) are bonded to each other so that the light emitting element (6) is exposed from the recess of the glass substrate (4). Thus, the copper material is embedded in a pass-through manner directly under a region of the lead frame where the light emitting element is disposed. Therefore, adhesion between the glass substrate and the lead frame is ensured, and heat generated by the light emitting element may be efficiently radiated from the rear surface of the glass substrate.

Dependencies are inferred from the claim text.