Semiconductor package and fabrication method thereof

A fabrication method for a light emitting element package, the method comprising:

• providing a temporary substrate;
• forming a semiconductor unit on the temporary substrate, the semiconductor unit comprising a plurality of light emitting elements, each comprising a first electrode and a second electrode;
• forming a plurality of protrusions on the first electrodes and the second electrodes;
• forming a first encapsulation layer on the temporary substrate to encapsulate the light emitting elements and the protrusions;
• mounting a package substrate on the first encapsulation layer, the package substrate electrically coupled to the protrusions;
• removing the temporary substrate;
• forming a second encapsulation layer on a downward surface of the light emitting elements and the first encapsulation layer to obtain a semi-finished product, the first encapsulation layer and the second encapsulation layer not being coplanar;
• and
• dicing the semi-finished product to form a plurality of light emitting element packages each corresponding to one of the light emitting elements.