Thermally-Enhanced Hybrid LED Package Components
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChung Yu Wang
Life of this patent
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Abstract
A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads.
Claims20
A light-emitting device (LED) package component comprising:
- an LED chip;
- and
- a carrier chip comprising:
- a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding;
- a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively;
- and
- at least one through substrate via (TSV) connected to the first and second bond pads.
A light-emitting device (LED) package component comprising:
- an LED chip;
- a carrier chip bonded onto the LED chip through flip-chip bonding, the carrier chip comprising a plurality of through substrate vias (TSVs);
- a first bond pad on a surface of the carrier chip;
- a second bond pad on the surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, wherein the first bond pad and the second bond pad are electrically interconnected by an ohmic line;
- a lead frame with the carrier chip mounted thereon;
- and
- a conductive wire connecting the lead frame to the first bond pad.
A light-emitting device (LED) package component comprising:
- a heat sink;
- a lead frame over and thermally coupled to the heat sink;
- a carrier chip over the lead frame, wherein the carrier chip comprises a plurality of dummy TSVs therein;
- a first thermal interface material (TIM) between the carrier chip and the lead frame, wherein the first TIM electrically insulates the lead frame from all of the plurality of dummy TSVs in the carrier chip;
- a first bond pad and a second bond pad on a surface of the carrier chip, wherein the first bond pad and the second bond pad are wire-bonded to the lead frame;
- and
- an LED chip over, and bonded onto, the carrier chip through flip-chip bonding, wherein two electrodes of the LED chip are electrically connected to the first bond pad and the second bond pad.
Dependencies are inferred from the claim text.