LED Flip-Chip Package Structure with Dummy Bumps
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChung Yu Wang
Life of this patent
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Abstract
A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip.
Claims21
A light-emitting device (LED) package component comprising:
- an LED chip comprising a first active bond pad and a second active bond pad;
- and
- a carrier chip bonded to the LED chip through flip-chip bonding, wherein the carrier chip comprises:
- a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively;
- and
- a dummy TSV in the carrier chip and configured not to conduct any current when a current flows through the LED chip.
A light-emitting device (LED) package component comprising:
- an LED chip comprising a first active bond pad and a second active bond pad configured to conduct a current flowing through the first and the second active bond pads for activating the LED chip to emit light, wherein the first and the second active bond pads have a first pitch;
- a carrier chip comprising a first active through-substrate via (TSV) and a second active TSV electrically connected to the first and the second active bond pads, respectively, wherein the LED chip and the carrier chip are bonded through flip-chip bonding;
- and
- a first solder ball and a second solder ball on the carrier chip and electrically connected to the first and the second active bond pads, respectively, wherein the first solder ball and the second solder ball are on an opposite side of the carrier chip than the LED chip, and wherein the first solder ball and the second solder ball have a second pitch greater than the first pitch.
A method of forming a light-emitting device (LED) package component, the method comprising:
- providing an LED wafer comprising an LED chip, wherein the LED chip comprises a first active bond pad and a second active bond pad;
- sawing the LED chip from the LED wafer;
- and
- bonding the first active bond pad and the second active bond pad of the LED chip onto a carrier chip through flip-chip bonding through soldering a first solder bump and a second solder bump, wherein the carrier chip comprises:
- a first active through-substrate via (TSV) and a second active TSV configured to electrically connect features on opposite sides of the carrier chip and a dummy TSV;
- wherein the first active TSV and the second active TSV are electrically connected to the first solder bump and the second solder bump, respectively;
- and
- wherein the dummy TSV is connected to the LED chip through a dummy solder bump.
Dependencies are inferred from the claim text.