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US 2011/0215357 A1Published application
Led package structure and method of manufacturing the same
AssigneeHarvatek Corporation
InventorsBILY WANG, SUNG-YI HSIAO
Life of this patent
Estimating the term…
Abstract
An LED package structure for increasing heat-dissipating efficiency includes providing a substrate element; removing one part of the substrate element in order to form at least two substrate bodies separated from each other and at least one gap between the at least two substrate bodies; forming at least one
Claims18
A method of manufacturing an LED package structure, comprising:
- providing a substrate element;
- removing one part of the substrate element in order to form at least two substrate bodies separated from each other and at least one gap between the at least two substrate bodies;
- forming at least one insulative layer into the at least one gap in order to connect the at least two substrate bodies with each other by the at least one insulative layer;
- positioning at least one light-emitting element on one of the at least two substrate bodies;
- electrically connecting the at least one light-emitting element between the at least two substrate bodies;
- and
- forming at least one packaged gel on the at least two substrate bodies and the at least one insulative layer in order to cover the at least one light-emitting element.
4 more elements
A method of manufacturing an LED package structure, comprising:
- providing a substrate element;
- removing one part of the substrate element in order to form at least three substrate bodies separated from each other and at least two gaps, wherein the at least three substrate bodies are divided into a middle substrate and two lateral substrates respectively disposed beside two lateral sides of the middle substrate, one of the at least two gaps is formed between the middle substrate and one of the two lateral substrate, and other one of the at least two gaps is formed between the middle substrate and other one of the two lateral substrate;
- respectively forming at least two insulative layers into the at least two gaps in order to connect the at least three substrate bodies with each other by the at least two insulative layers;
- positioning at least one light-emitting element on the middle substrate;
- electrically connecting the at least one light-emitting element between the two lateral substrates;
- and
- forming at least one packaged gel on the at least three substrate bodies and the at least two insulative layers in order to cover the at least one light-emitting element.
4 more elements
An LED package structure, comprising:
- a substrate unit having at least two substrate bodies separated from each other and at least one gap between the at least two substrate bodies;
- an insulative unit having at least one insulative layer formed into the at least one gap for connecting the at least two substrate bodies with each other;
- a light-emitting unit having at least one light-emitting element disposed on the substrate unit and electrically connected between the at least two substrate bodies;
- and
- a package unit having at least one packaged gel disposed on the substrate unit and covering the at least one light-emitting element.
2 more elements
Dependencies are inferred from the claim text.