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US 2011/0215353 A1Published application
Light emitting device package and method for fabricating the same
AssigneeLG Innotek Co., Ltd.
InventorsYu Ho Won, Geun Ho Kim
Life of this patent
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Abstract
A light emitting device package comprises a substrate, an electrode on the substrate, a light emitting device on the substrate and electrically connected to the electrode layer, and a pattern enclosing the light emitting device.
Claims20
A light emitting device package comprising:
- a substrate;
- an electrode layer on the substrate;
- a light emitting device on the substrate and electrically connected to the electrode layer;
- and
- a filling enclosing the light emitting device and comprising a predetermined pattern.
2 more elements
A light emitting device package comprising:
- a substrate;
- an electrode on the substrate;
- a light emitting device on the substrate and electrically connected to the electrode layer;
- a filling enclosing the light emitting device;
- and
- a photoresist pattern on the filling.
3 more elements
A light emitting device package comprising:
- a substrate;
- an electrode on the substrate;
- a light emitting device on the substrate and electrically connected to the electrode layer;
- a filling enclosing the light emitting device;
- and
- a phosphor layer on the filling and comprising a predetermined pattern.
3 more elements
A method for fabricating a light emitting device package, the method comprising:
- providing a substrate;
- forming an electrode layer on the substrate;
- installing a light emitting device on the substrate and electrically connecting the light emitting device to the electrode layer;
- enclosing the light emitting device with a filling;
- and
- forming a light extracting pattern on the filling.
3 more elements
Dependencies are inferred from the claim text.