Light emitting device and method thereof

A light emitting device comprising:

• a conductive support member
• a plurality of chip regions defining light emitting structures on the conductive support member;
• an isolation region between the chip regions on the conductive support member;
• and
• at least one buffer structure at the isolation region,
• wherein the light emitting structure and the buffer structure include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, and
• wherein the buffer structure includes a zener device.

A light emitting device package comprising:

• a body;
• first and second electrodes on the body;
• a light emitting device electrically connected to the first and second lead electrodes on the body;
• and
• a molding member surrounding the light emitting device on the body,
• wherein the light emitting device includes:
• a conductive support member
• a plurality of chip regions defining light emitting structures on the conductive support member;
• an isolation region between the chip regions on the conductive support member;
• and
• at least one buffer structure at the isolation region, and
• wherein the light emitting structure and the buffer structure include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer.