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US 2011/0215343 A1Published application
Semiconductor device and optical pickup device
AssigneePanasonic Corporation
InventorsNoriyuki Yoshikawa, Hiroyuki Ishida
Life of this patent
Estimating the term…
Abstract
By increasing the width of a lead terminal 2 connected to a die pad 1 in the vicinity of the die pad 1 and forming a slit 9 and a projecting plate in the lead terminal in the region where resin 5 is formed, it is possible to ensure the holding strength of the lead terminal by the resin 5, as well as ensuring the strength of the lead terminal during the manufacturing process and achieving a reduction in thickness.
Claims10
-11. (canceled)
A semiconductor device, in which a semiconductor element is mounted on a lead frame,
- wherein the lead frame comprises:
- a die pad on which the semiconductor element is mounted;
- a first lead terminal being an external terminal connected to the die pad;
- one or a plurality of second lead terminals being external terminals formed separately from the die pad;
- the first lead terminal being displaced from the die pad by means of a bend section and extending in a direction parallel to a surface of the die pad;
- resin of a frame structure formed so as to hold the first lead terminal and the second lead terminal while forming wall faces in at least three directions in a region for mounting the semiconductor element, including a portion of the first lead terminal and the second lead terminal adjacent to the die pad;
- a projecting plate formed by cutting out from the first lead terminal in which the bend section is formed in a region where the resin is formed, in a state where an edge on an opposite side to a direction of the die pad is connected;
- and
- a slit formed by bending the projecting plate from the first lead terminal, and
- wherein the projecting plate protrudes from the first lead terminal inside the resin, and the resin is also formed inside the slit.
7 more elements
(canceled)
Dependencies are inferred from the claim text.