Led packaging with integrated optics and methods of manufacturing the same
AssigneeSo-Semi Technologies, LLC
InventorSteven D. Oliver
Life of this patent
Estimating the term…
Abstract
Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.
Claims55
A method for simultaneously integrating optical elements on a plurality of light-emitting diodes (LEDs), the LEDs having a front side for emitting light, comprising:
- dispensing an encapsulation material onto a plurality of LEDs on a packaging substrate;
- simultaneously shaping the encapsulation material over the plurality of LEDs;
- and
- curing the encapsulation material to form encapsulations in front of the LEDs in the array.
A method of forming an array of LED die on a packaging substrate, the method comprising:
- providing the substrate, wherein the substrate comprises an array of patterned metal contacts on a front side, the metal contacts being in electrical communication with control logic formed in the substrate;
- mounting a plurality of pre-fabricated and singulated LED die on the substrate;
- and
- electrically connecting the LED die with the metal contacts.
A method for manufacturing LEDs, the method comprising:
- mounting a plurality of pre-fabricated and singulated LED die onto a packaging substrate to form an array of substrate-mounted LEDs;
- and
- laminating an array of molded micro-mirror reflectors onto the array of substrate-mounted LEDs.
An array of LED die formed on a common packaging substrate comprising:
- metal contacts formed on a front side of the common packaging substrate, wherein the metal contacts are electrically connected to leads formed on one of the front side and a back side of the substrate;
- the array of LED die mounted on the front side of the substrate, each LED die being in electrical contact with at least one of the metal contact on the substrate;
- and
- an array of encapsulations, wherein each encapsulation encapsulates one or more of the LED die mounted on the substrate.
An array of LED die formed on a common packaging substrate comprising:
- metal contacts formed on a front side of the common packaging substrate, wherein the metal contacts are electrically connected to leads formed on one of the front side and a back side of the substrate;
- a plurality of LED die mounted on the front side of the substrate to form the array, each LED die being in electrical contact with at least one of the metal contacts on the substrate;
- and
- a laminated array of micro-mirror reflectors surrounding the LEDs, wherein each micro-mirror reflector in the array surrounds one or more of the LED die mounted on the substrate and the micro-mirror reflector and wherein each micro-mirror reflector comprises a smooth curved surface.
An encapsulated LED having a front side for emitting light comprising:
- an LED mounted onto a packaging substrate, the packaging substrate comprising electrically conductive contacts in electrical connection with the LED and electrical leads electrically connected to the conductive contacts, wherein the conductive contacts are in electrical communication with the electrical leads through electrical traces formed in the substrate;
- and
- a molded encapsulation in front of the LED, the molded encapsulation encapsulating the LED and a portion of the packaging substrate surrounding the LED.
A method for packaging a plurality of light-emitting diodes, the method comprising:
- dispensing a molding material onto a stamping tool;
- stamping and curing the molding material to form an array of lenses;
- and
- aligning and bonding the array of lenses onto an array of light-emitting diode die mounted onto a packaging substrate.
Dependencies are inferred from the claim text.