Semiconductor storage device and manufacturing method thereof
AssigneeRenesas Electronics Corporation
InventorsYuichi MATSUI, Tomio IWASAKI, Norikatsu TAKAURA, Kenzo KUROTSUCHI
Life of this patent
Estimating the term…
Loading patent…
AssigneeRenesas Electronics Corporation
InventorsYuichi MATSUI, Tomio IWASAKI, Norikatsu TAKAURA, Kenzo KUROTSUCHI
Estimating the term…
Since a chalcogenide material has low adhesion to a silicon oxide film, there is a problem in that it tends to separate from the film during the manufacturing step of a phase change memory. In addition, since the chalcogenide material has to be heated to its melting point or higher during resetting (amorphization) of the phase change memory, there is a problem of requiring extremely large rewriting current. An interfacial layer includes an extremely thin insulator or semiconductor having the function as both an adhesive layer and a high resistance layer (thermal resistance layer) is inserted between chalcogenide material layer/interlayer insulative film and between chalcogenide material layer/plug.
A semiconductor storage device including;
A semiconductor storage device comprising;
A semiconductor storage device including:
A semiconductor storage device including:
Dependencies are inferred from the claim text.