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AssigneeRaytheon Company
InventorsVictor D. Kruppa, Richard A. Schmidt
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Embodiments of a system to maintain an even temperature distribution across a laser detector are generally described herein. In some embodiments, the system includes a multi-layer printed circuit board (PCB) assembly that includes a first layer comprising a thermally-conductive ring provided circumferentially around a thermally-conductive detector region for mounting the laser detector, a second layer comprising a plurality of resistive elements aligned with the thermally-conductive detector region to generate heat, and a fourth layer comprising a thermally-conductive heat-distribution region aligned with the thermally-conductive detector region. A plurality of thermally-conductive vias is provided to couple the thermally-conductive ring of the first layer to the thermally-conductive heat-distribution region of the fourth layer. The thermally-conductive vias transfer heat between the thermally-conductive heat-distribution region and the thermally-conductive ring to provide an even distribution of heat across the laser detector.
A system to maintain an even distribution of heat across a laser detector, the system including a multi-layer printed circuit board (PCB) assembly, the system comprising:
A system to maintain a substantially even temperature distribution across a laser detector, the system comprising:
A thermal containment and thermal-balancing structure comprising a plurality of printed-circuit board (PCB) layers that include a plurality of thermally-conductive vias that form a cage to evenly distribute heat across a laser detector, wherein the layers include:
Dependencies are inferred from the claim text.