Rotary die bonding apparatus and methodology thereof
OwnerAh Yoong SIMinventor
Life of this patent
Estimating the term…
Abstract
The present invention relates generally to a rotary die bonding apparatus (102) comprising a vertical motion linear actuator and a rotary motion actuator with a plurality of pick up heads (116) for transferring semiconductor die (122) from diced wafer to the lead frame for die bonding process, wherein said plurality of pick up heads (116) performs its assigned task such as pick (126), die bonding (132), inspection (128) and others simultaneously upon reaching its specific location and rotates to another location upon completion of each task to perform the next assigned task.
Claims16
A rotary semiconductor die bonding apparatus comprising:
- a plurality of pick up heads;
- further comprising:
- a direct drive rotary motor indexer;
- a rotary dish;
- said plurality of pick up heads are attached to the circumference of said rotary dish;
- said plurality of pick up heads are arranged to be the same distance from the central point of said rotary dish.
A methodology of semiconductor die bonding, comprising the following stages:
- (i) in the first stage:
- (i)(i) at the first station, the following steps are taken:
- (i)(i)(i) vertical motion actuator at first station pushes said first pick up head to semiconductor die;
- (i)(i)(ii) rotary semiconductor die bonding apparatus activates vacuum pressure to the first pick up head to apply vacuum pressure between said first pick up head and said semiconductor die;
- (i)(i)(iii) vertical motion actuator at first station pulls said first pick up head to pick said semiconductor die;
- (i)(ii) at the second station, the camera at second station captures image of semiconductor die picked up by the second pick up head previously at the first station, for inspection;
- (i)(iii) at the third station, the third pick up head purges or releases rejected dies;
- (i)(iv) at the fourth station, the following steps are taken:
- (i)(iv)(i) vertical motion actuator at fourth station pushes the fourth pick up head to a specific location for die bonding;
- (i)(iv)(ii) rotary semiconductor die bonding apparatus deactivates vacuum pressure to the fourth pick up head to eliminate vacuum pressure between said fourth pick up head and semiconductor die;
- (i)(iv)(iii) vertical motion actuator at fourth station pulls said fourth pick up head;
- (ii) in the second stage, the rotary dish at the rotary semiconductor die bonding apparatus rotates to transfer the following pick up heads to the following stations:
- the first pick up head to the second station;
- the second pick up head to the third station;
- the third pick up head to the fourth station;
- the fourth pick up head to the first station;
- (iii) in the third stage, the rotary dish at the rotary semiconductor die bonding apparatus rotates to transfer the following pick up heads to the following stations:
- the first pick up head to the third station;
- the second pick up head to the fourth station;
- the third pick up head to the first station;
- the fourth pick up head to the second station;
- (iv) in the fourth stage, the rotary dish at the rotary semiconductor die bonding apparatus rotates to transfer the following pick up heads to the following stations:
- the first pick up head to the fourth station;
- the second pick up head to the first station;
- the third pick up head to the second station;
- the fourth pick up head to the third station;
- wherein all said stages is repeated.
Dependencies are inferred from the claim text.