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US 2011/0214994 A1Published application
Pretreating agent for electroplating, pretreatment method for electroplating, and electroplating method
AssigneeC. Uyemura & Co., Ltd.
InventorsMasayuki Utsumi, Naoyuki Omura, Takuya Okamachi
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Abstract
A pretreating agent for electroplating includes an aqueous solution containing, as essential ingredient, (A) at least one anti-adsorption agent selected from among a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant, and an amphoteric surfactant, and (B) chloride ion. The pretreating agent does not impair adhesion between substrate copper and a photoresist, and does not damage adhesion between the substrate copper and an electrolytic copper plating film.
Claims14
A pretreating agent for electroplating comprising an aqueous solution containing:
- (A) at least one anti-adsorption agent selected from the group consisting of a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant and an amphoteric surfactant;
- and
- (B) chloride ion.
Dependencies are inferred from the claim text.