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US 2011/0214912 A1Published application
Via structure for multi-gigahertz signaling
AssigneeBroadcom Corporation
InventorShengli LIN
Life of this patent
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Abstract
A via structure is disclosed to pass electronic signals from a first conductive pathway formed on a first outermost substrate of a multi-layer PCB to a second conductive pathway formed on a second outermost substrate of the multi-layer PCB. The via structure allows the electronic signals to pass from the first outermost substrate through one or more inner substrates to the second outermost substrate. The one or more inner substrates include one or more closed geometric structures to enclose the via structure.
Claims20
A multi-layer printed circuit board (PCB), comprising:
- a first conductive pathway formed onto a first substrate;
- a second conductive pathway formed onto a second substrate;
- a via structure formed through a third substrate to connect the first conductive pathway to the second conductive pathway;
- and
- a first closed geometric structure formed onto a surface of the third substrate to enclose the via structure.
2 more elements
A multi-layer printed circuit board (PCB), comprising:
- a first conductive pathway formed onto a first substrate;
- a second conductive pathway formed onto a second substrate;
- a via structure formed through a third substrate to connect the first conductive pathway to the second conductive pathway;
- and
- one or more closed geometric structures formed onto a surface of the inner non-conductive to form a plurality of capacitors, the plurality of capacitors being arranged in series from the via structure to an outer most one of the one or more closed geometric structures
2 more elements
Dependencies are inferred from the claim text.